During semiconductor device fabrication, thin film growth and deposition steps typically occur more number of times than any other process. These are often critical processes that require careful thickness and quality control. For example, during silicon (Si) transistor fabrication, growth of a thin film of silicon dioxide (SiO2) is generally required immediately after the RCA clean process. This oxide can be grown on the Si wafer surface using different processes that define its growth rate and quality. Whatever the chosen process, maintaining tight control of process conditions and minimizing contamination on the Si wafer surface during the growth process is critical for final device performance. Hence, separate process-based oxide growth furnaces are needed for the same.

Thin film depositions of other materials are also needed at various stages of device fabrication – from the initial active semiconducting layers to the final metal contact layers. With new materials being explored for various applications today, dedicated systems and novel deposition techniques are required to integrate them into devices. Pulsed laser deposition (PLD) and atomic layer deposition (ALD) are two examples of such enabling capabilities available at IITBNF, along with conventional silicon processing equipment. Conventional metal and insulator deposition tools, along with dedicated anneal systems, complete the expansive gamut of deposition capabilities at IITBNF for introducing new materials onto the silicon platform and fabricating new device structures.

The following list includes dedicated growth, deposition and anneal systems for 2”, 4” and 8” silicon wafers at IITBNF; along with separate tools for other substrate materials and sizes. Implantation tools are also included in the list since they are used in conjunction with anneal systems.


InstrumentLocationContamination category
1 Inductively coupled plasma CVD (ICPCVD) Nano Labsemi clean b
2 Rapid Thermal Processing(RTP) Nano Labgold contaminated
3 Hot wire CVD(HWCVD) Micro2 Labgold contaminated
4 Organic Evaporation System Micro2 Labgold contaminated
5 Ultech Furnace Dry Oxide Nano Labclean
6 2 inch Annealing Furnace (Gen purpose Forming gas/ Ar annealing furnace) Micro1 Labgold contaminated
7 2 inch Boron_Solid source Diffusion Furnace Micro1 Labclean
8 2 inch CMOS specific FGA furnace Micro1 Labsemi clean b
9 2 inch Dry oxidation Furnace Micro1 Labclean
10 2 inch Wet oxidation Furnace Micro1 Labclean
11 2 inch N2 Annealing Furnace Micro1 Labclean
12 2 inch Phosphorous_Solid source Diffusion Furnace Micro1 Labclean
13 4 target E-beam evaporator Micro1 Labgold contaminated
14 Dielectric - sputter System Micro1 Labgold contaminated
15 Metal - sputter System Micro1 Labgold contaminated
16 Thermal Evaporator - Al Micro1 Labgold contaminated
17 Thermal Evaporator-Cr/Au Micro1 Labgold contaminated
18 PLD I Nanoelectronics Processing Lab (NanoE bldg, 1st floor)gold contaminated
19 PLD II Nanoelectronics Processing Lab (NanoE bldg, 1st floor)clean
20 6 Target E Beam Evaporator MBE Clean Room 2 (NanoE bldg, Gr floor)gold contaminated
21 AMAT - FEP Centura - DPN Chamber (Ch-A) AMAT Labclean
22 AMAT - FEP Centura - Polygen Chamber (Ch-B) AMAT Labsemi clean a
23 AMAT - FEP Centura - RTP Chamber (Ch-C) AMAT Labclean
24 AMAT - PVD - Al2O3 (Ch-1) AMAT Labsemi clean a
25 AMAT - PVD - TiN (Ch-D) AMAT Labsemi clean a
26 PLD target making furnace EC Labclean
27 Electro Plating system (Cu) EC Labsemi-clean pv
28 Molecular Beam Epitaxy III-V MBE Clean Room 1 (NanoE bldg, Gr floor)clean (III,V compounds)
29 In Thermal Evaporator MBE Clean Room 2 (NanoE bldg, Gr floor)gold contaminated
30 Ultech Furnace Silicon Oxynitride (SiON) Nano Labclean
31 Ultech Furnace Pyrogenic Oxide Nano Labclean
32 Ultech Furnace Low Temperature Oxide (LTO) Nano Labclean
33 Ultech Furnace Silicon Nitride (SiN) Nano Labclean
34 Ultech Furnace Drive In Nano Labclean
35 Ultech Furnace i-poly Nano Labgold contaminated
36 Ultech Furnace Anneal Nano Labclean
37 Ultech Furnace n-doped poly Nano Labclean
38 2 inch general purpose anneal furnace Wet Chemistry labsemi clean
39 Sputter (ATC 2200) Nano Labsemi clean b
40 Sputter (Orion) Nano Labgold contaminated
41 ALD Nano Labsemi clean b
42 ALD LL Nano Labsemi clean b
43 Electroplating system - Au/Ni/Cu EC Labgold contaminated
44 Multi-pocket Electron-beam Evaporator (4 target - GaN) Micro1 Yellow Roomgold contaminated
45 Multi target sputter – AJA International NMPF Labgold contaminated
46 Parylene CVD – SCS NMPF Labgold contaminated
47 LPCVD Furnace_SixNy NMPF Labclean
48 LPCVD Furnace_PolySi, Doped PolySi NMPF Labclean
49 LPCVD Furnace_Thermal oxidation NMPF Labclean
50 Rapid Thermal Annealing – Annealsys NMPF Labclean
51 Plasma Doping System Nanoelectronics Processing Lab (NanoE bldg, 1st floor)semi clean b
52 Molecular Beam Epitaxy III Nitrides MBE Clean Room 1 (NanoE bldg, Gr floor)semi clean a
53 Molecular Beam Epitaxy Si, Ge, Sn MBE Clean Room 1 (NanoE bldg, Gr floor)clean
54 Graphene specific Argon annealing system Nanoelectronics Processing Lab (NanoE bldg, 1st floor)gold contaminated
55 Gold Electroplating System Micro1 Labclean
56 PLD III Nanoelectronics Processing Lab (NanoE bldg, 1st floor)clean
57 PLD IV Nanoelectronics Processing Lab (NanoE bldg, 1st floor)clean
58 Hot plate with stirrer (1)_Fume Hood 1 7.1 Labtbd
59 Hot plate with stirrer (2)_Fume Hood 1 7.1 Labtbd
60 2 inch general purpose annealing furnace_Fume hood 3 7.1 Laboff line a
61 Dip Coater 7.1 Labgold contaminated
62 Hot plate with stirrer (3)_2 arm glove box 7.1 Labtbd
63 Hot plate with stirrer (4)_4-arm glove box 7.1 Labtbd
64 Schlenk Line (2)_Fume Hood 3 7.1 Labgold contaminated
65 Atmospheric Furnace_AMAT CLEAN Lab 7.1 Labtbd
66 Drying Oven_AMAT CLEAN Lab 7.1 Labtbd
67 Tube Furnace_Fume hood 5 7.1 Labtbd
68 AJA 6 Target E beam Evaporator Nanoelectronics Processing Lab (NanoE bldg, 1st floor)gold contaminated
69 AMAT-PVD-Preclean (Ch-C) AMAT Labclean
70 pH Meter 7.1 Labclean
71 Spin Coater_4 arm glove box 7.1 Labclean
72 SILAR controller 7.1 Labclean
73 Thermogravimetric Analyzer 7.1 Labclean
74 Hydrothermal Reactor_Fume Hood 2 7.1 Labclean
75 Fume Hood 4 7.1 Labclean
76 Laser 2_4 Nanoelectronics Processing Lab (NanoE bldg, 1st floor)clean
77 Eppendorf FemtoJet 4x Microinjector Bio Sensors Lab (NanoE bldg, 7th floor)clean
78 Laser 1_3 Nanoelectronics Processing Lab (NanoE bldg, 1st floor)clean
79 Magneto Optic Kerr Effect (MOKE) Spintronics Labclean
80 Magnetoresistance Setup Applied Quantum Mechanics Lab 2(NanoE bldg, 5th floor)clean
81 Magnetoresistance Setup with Vector Network Anlyser (VNA) and Rotating stage Spintronics Labclean
82 2D Materials CVD 2D Materials and Devices Labclean
  • To understand what the contamination categories mean, click here

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  • To view current working status of all the instruments, click here