Equipment Details



Name of the EquipmentDeep Reactive Ion Etching – Samco
Categorysemi clean a
OperatorHemant Kshirsagar
System OwnerPradnya Chabbi
pradnya@ee.iitb.ac.in

Hemant Kshirsagar
hemant@ee.iitb.ac.in

Short Name
Make/ ModelSAMCO
Critical ToolNo
Serial Number400 iPB
FootPrint
InstallationDate05/01/2017
Equipment TypeDry Etch tools
LocationNMPF Lab
AMC Required
Local Dealer

Actual Dealer

amamori-hiro@samco.co.jp
SOP
Training & other policy documents
Recipies
Glimpse
Tool Facilities Requirements
AccessControlled
Lab Phone No6252
Substrate allowedSi, diamond
Substrate DimensionMaximum 4 inch wafer
Chemical allowed, Photoresist, SiO2, SiN, EBL resist.
Precursors/ Targets allowed
*Based on stock availability
Precursor/ Target loaded inside tool
Target dimension
Gases allowedSF6, C4F8, O2, Ar, PN2, GN2
Contamination remarksMetals, if present on the sample, should not be exposed to plasma. Need to cover them with resist.