Equipment Details



Name of the EquipmentWire Bonder
Categorygold contaminated
Operator
System OwnerKulasekaran Muniappan
kulasekaran.m@iitb.ac.in

Short NameHybond 626 Wire Bond
Make/ ModelHybond Inc/ 626 Multipurpose Dig
Critical ToolNo
Serial Number2135
FootPrint
InstallationDate04/12/2006
Equipment TypeMiscellaneous
Location7.1 Lab
AMC Required
Local DealerEl Camino Technologies Pvt. Ltd.

#8, 1st block, 1st main, BEL Layout, Vidyaranyapura, Bangalore - 560 097, INDIA. Tel: 91 80 23640503 Fax: 91 80 23641170
Actual DealerHybond, Inc

330 State Place Escondido, California,92029, USA Tel:1-760-746-7105 Fax:1-760-746-1408
SOP
Training & other policy documents
Recipies
Glimpse GLIMPSE/128_Glimpse.pdf
Tool Facilities RequirementsVacuum Pump
AccessOpen
Lab Phone No4419
Substrate allowedSi/ III-V
Substrate DimensionPieces to 4 inch
Chemical allowedN/A, Ti/ Al/ Ni/ Pt/ Au/ Cr etc
Precursors/ Targets allowed
*Based on stock availability
N/A
Precursor/ Target loaded inside tool
Target dimensionN/A
Gases allowedN/A
Contamination remarksN/A